VALVE FOR CONTROLLING PRESSURE AND APPARATUS FOR DEPOSITIONING THIN FILM ON WAFER HAVING THE VALVE

摘要

A pressure controlling valve and a thin film depositing apparatus having the valve are provided to improve efficiency of a thin film deposition process by discharging more gas during purging than during feeding to reduce purging time. A pressure controlling valve(50) includes a housing(51), an opening and closing member(521), and a driving unit. The housing is coupled with a gas flow line and has a conduit(511c) connected to the gas flow line. The opening and closing member has a through hole(521a) and is installed inside the conduit to be located between a closed position to close the conduit and an open position to open the conduit. The driving unit drives the opening and closing member to be located between the closed position and the open position.