| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing electronic components capable of manufacturing an electronic device with high airtight sealing reliability for which many wiring board regions formed on a mother board are airtightly sealed with the lid body of a wide area altogether and the lid body is surely bonded to the mother board even when the wiring board regions are divided into individual pieces. <P>SOLUTION: The package 9 for housing the electronic component comprises: a multiple wiring board 8 for which the plurality of wiring board regions 2 are laterally and longitudinally arrayed and formed on the main surface of the mother board 1 and recessed parts 2a are formed in the wiring board regions 2; and the lid body 3 bonded to the mother board 1 so as to cover the whole of the plurality of wiring board regions 2. For the lid body 3, a projection part 3a whose side face is to be joined facing the inner side face of the recessed part 2a is formed along the inner side face of the recessed part 2a. The bonding of the lid body 3 and the mother board 1 is reinforced by bonding the projection part 3a and the inner side face of the recessed part 2a, the lid body 3 is strongly bonded to the mother board 1, and the electronic device with high airtight sealing reliability is manufactured. <P>COPYRIGHT: (C)2008,JPO&INPIT |
