| 摘要 |
PROBLEM TO BE SOLVED: To uniformly heat a semiconductor substrate having both thick and thin portions. SOLUTION: The semiconductor substrate 10 with a photo resist 18 applied onto a first main surface 12 is heated from a second main surface 14 thereof. A projected 14a and a recessed part 14b are formed on the second main surface 14 of the semiconductor substrate 10. The surface of a thick portion 16a of the semiconductor substrate 10 is heated first, however, the surface of a thin portion 16b thereof is not heated. This state is kept for a specified time. Next, the surface of the thin portion 16b thereof is heated. Then, both thick and thin portions 16a and 16b are kept heated. COPYRIGHT: (C)2008,JPO&INPIT
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