发明名称 Electroless gold plating bath, electroless gold plating method and electronic parts
摘要 An electroless gold plating bath includes a water-soluble gold compound, a completing agent, an aldehyde compound, and an amine compound represented by R<SUB>1</SUB>-NH-C<SUB>2</SUB>H<SUB>4</SUB>-NH-R<SUB>2 </SUB>or (CH<SUB>2</SUB>-NH-C<SUB>2</SUB>H<SUB>4</SUB>-NH-CH<SUB>2</SUB>)<SUB>n</SUB>-R<SUB>4 </SUB>(wherein R<SUB>1 </SUB>to R<SUB>4 </SUB>represent -OH, -CH<SUB>3</SUB>, -CH<SUB>2</SUB>OH, -C<SUB>2</SUB>H<SUB>4</SUB>OH, -CH<SUB>2</SUB>N(CH<SUB>3</SUB>)<SUB>2</SUB>, -CH<SUB>2</SUB>NH(CH<SUB>2</SUB>OH), CH<SUB>2</SUB>NH(C<SUB>2</SUB>H<SUB>4</SUB>OH), -C<SUB>2</SUB>H<SUB>4</SUB>NH(CH<SUB>2</SUB>OH), -C<SUB>2</SUB>H<SUB>4</SUB>NH(C<SUB>2</SUB>H<SUB>4</SUB>OH), -CH<SUB>2</SUB>N(CH<SUB>2</SUB>OH)<SUB>2</SUB>, -CH<SUB>2</SUB>N(C<SUB>2</SUB>H<SUB>4</SUB>OH)<SUB>2</SUB>, -C<SUB>2</SUB>H<SUB>4</SUB>N(CH<SUB>2</SUB>OH)<SUB>2 </SUB>or -C<SUB>2</SUB>H<SUB>4</SUB>N(C<SUB>2</SUB>H<SUB>4</SUB>OH)<SUB>2</SUB>, and n is an integer of 1 to 4). The electroless gold plating can be carried out without corrosion of an underlying metal to be plated at a stable deposition rate. Because of the high deposition rate and the immersion and reduction types, thickening of a plated coating is possible in one solution and the color of the coating is not degraded to provide a good appearance while keeping a lemon yellow color inherent to gold.
申请公布号 US2008138507(A1) 申请公布日期 2008.06.12
申请号 US20070987881 申请日期 2007.12.05
申请人 C. UYEMURA & CO., LTD. 发明人 KISO MASAYUKI;SAIJO YOSHIKAZU;KAMITAMARI TOHRU
分类号 C23C18/32;C23C18/42;C23C18/54 主分类号 C23C18/32
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