| 摘要 |
A semiconductor wafer 10 has a plurality of semiconductor chip areas 10 a and a scribe area 10 b, each of the semiconductor chip areas 10 a having semiconductor elements and electrode pads (electrode portions) 16 a electrically connected to the respective semiconductor elements, the scribe area 10 b having monitor elements and electrode pads (electrode portions) 16 b electrically connected to the monitor elements, wherein projecting electrodes 18 are selectively formed only on the respective electrode pads 16 a in the semiconductor chip areas 10 a by electroless plating. Thus, for example, the electrode pads 16 b are covered with an insulating film 14.
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