| 摘要 |
An image sensor module is provided to obtain the maximum manufacturing yield during a module/system assembling process by forming a protective layer on a micro-lens. A die(302) is formed on a substrate(301), and has a micro-lens formed thereon. A lens holder(306) is formed on the substrate over the die. A lens(308) is formed in the lens holder, and a filter(307) is formed between the lens and the die within the lens holder. At least one passive device(304) is formed on the substrate and is covered within the lens holder. Conductive bumps are formed on the bottom surface of the substrate. The die is connected to the conductive bumps via wires formed on the die, and the filter is an IR filtering layer comprising TiO2 or photo catalytic agent. |
