| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable that makes high-reliability connecting layers possible. SOLUTION: The diameter of a via Ve1, arranged in a base material 10e forming the innermost layer in an interlayer joint part 11A, is made larger than the diameters of respective vias Va1, Vb1, ..., Vd1, Vf1, Vg1, ..., Vi1 which are arranged in the base materials 10a, 10b, ..., 10d, 10f, 10g, ..., 10i that form each of the layers. COPYRIGHT: (C)2008,JPO&INPIT |
