| 摘要 |
PROBLEM TO BE SOLVED: To provide a brittle material cutting method free from a defective product by welding cullet to a semiconductor wafer by the heat of a laser beam, and also to provide a brittle material cutting apparatus. SOLUTION: A double-side pressure-sensitive adhesive sheet 12 is constituted of: an intermediate laminated tape base material 12a; a first adhesive layer 12b laminated on the surface of the double-side pressure-sensitive adhesive sheet to bond and support the semiconductor wafer 3 being the brittle material; and a second adhesive layer 12c laminated on the undersurface of the double-side pressure-sensitive adhesive sheet to bond a transparent support sheet 13. A groove 3b is formed to the semiconductor wafer 3 along a cutting line by a scriber 22 and, when the groove 3b is irradiated with an infrared laser beam from the back side of the semiconductor wafer 3, the infrared laser beam transmits through the transparent support sheet 13 and the second adhesive layer 12c to irradiate the first adhesive layer 12b and, when the first adhesive layer 12b is locally expanded by heating, a crack is developed from the groove 3b to cut the semiconductor wafer 3. COPYRIGHT: (C)2008,JPO&INPIT |
