| 摘要 |
An electronic component-inspection wiring board ( 1 ) including: a first laminate (C 1 ) composed of plural first ceramic layers (s 1 -s 3 ) and having plural pads ( 6 ) formed on a front surface ( 2 ) thereof for electrically connecting and transmitting inspection signals to an electronic component subject to inspection, wiring layers ( 7, 9 ) formed between the first ceramic layers (s 1 -s 3 ), and plural via-conductors (v) connecting respective pads ( 6 ) to the wiring layers ( 7, 9 ) and/or which are exposed on a rear surface ( 3 ) of the first laminate (C 1 ); and a second laminate (C 2 ) composed of second plural ceramic layers (s 4 -s 6 ) made of the same ceramic material as that of the first ceramic layers (s 1 -s 3 ), having plural via-conductors (V) extending between front surface ( 4 ) and rear surface ( 5 ) of the second laminate (C 2 ), and the rear surface ( 3 ) of the first laminate (C 1 ) overlying the front surface ( 4 ) of the second laminate (C 2 ), wherein lands ( 10 ) connecting a via-conductor (v) exposed on the rear surface ( 3 ) of the first laminate (C 1 ) and a via-conductor (V) exposed on the front surface ( 4 ) of the second laminate (C 2 ) are disposed between the first laminate (C 1 ) and the second laminate (C 2 ), and the diameter d 1 of the land is 2-5 times larger than the diameter d 2 of a via-conductor (v, V) connected to the land ( 10 ).
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