| 摘要 |
There is disclosed an interconnect assembly. In an embodiment, the interconnect assembly includes conductive contact bumps extending from a bumped flex circuit assembly, and conductive contact pads attached to a rigid printed circuit assembly, having a contact surface having a hole and an abutment zone adjacent to the hole, wherein the contact surface is sized to allow contact, prior to disposition within the hole, by the distal end of one of the bumps, and wherein the abutment zone is sized to allow contact of the lateral periphery, and prevent contact of the distal end, of the bump disposed within the hole. A method of forming an interconnect is disclosed. In one embodiment the method includes wiping lateral portions of conductive contact bumps against conductive contact pads, and abutting lateral portions of the bumps against the pads without contacting distal ends of the bumps. Other embodiments are also disclosed.
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