| 摘要 |
A first substrate ( 11 a) is positioned on a support surface ( 7 ) in a vacuum chamber with an upward-facing first bonding surface ( 12 a) spin-coated with adhesive while a second substrate ( 11 b) is held with downward-facing second bonding surface ( 12 b) to a cover ( 3 ) by suction. While the vacuum chamber is being evacuated to a pressure of between 0.1 mbar and 2 mbar, a support pin ( 9 ) is extended through central openings ( 14 a , 14 b) of the substrates ( 11 a , 11 b) and then retracted with the second substrate ( 11 b) released from the cover ( 3 ) and carried by radially extended balls ( 10 ). The support pin ( 9 ) is lowered to a position where the balls ( 10 ), acting against the first bonding surface ( 12 a), deform the first substrate ( 11 a). The first bonding surface ( 12 a) being therefore slightly concave, the first and second bonding surfaces ( 12 a , 12 b) only touch close to their circumferences. Retraction of the balls ( 10 ) causes a spreading of the contact area radially inwards to cover the first and second bonding surfaces ( 12 a , 12 b) without entrapment of non-bonded areas. The substrates ( 11 a , 11 b) are then lifted by the support pin ( 9 ) with again extended balls ( 10 ) and pressed against the cover ( 3 ) and the vacuum chamber is aired. |
