| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compact solid-state imaging device which prevents the pressure in the sealed space of an imaging element from rising owing to heat generation in a sealing (bonding) stage, and secures the adhesive strength of an IR cut filter. <P>SOLUTION: The solid-state imaging device has: a circuit board 1 mounted with an imaging element 2; a case 13 covering the circuit board 1; and the IR cut filter and a lens 7 disposed in the case, and also has: an IR cut filter holding unit 9 holding the IR cut filter 14; a through hole 12 as an air vent bored in the IR cut filter holding unit 9; and opening portions 14a and 14b bored in the IR cut filter 14, wherein at least one of the opening portions 14a and 14b is disposed overlapping the through hole 12. <P>COPYRIGHT: (C)2008,JPO&INPIT |
