| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package substrate capable of inhibiting degradation in electric characteristics. <P>SOLUTION: A manufacturing method of the package substrate includes a first step of respectively forming a plurality of ball pads 12 at equal intervals on a substrate 11a and forming a plurality of signal lines 13 connected with the plurality of formed ball pads, a second step of forming an interconnection line 17 on a cavity forming part LN22, respectively forming a plurality of plating line 15a connected from one end of the plurality of signal lines to the interconnection line and forming a current supply line 14a from one arbitrary ball pad toward the outer periphery of the substrate, a third step of electroplating the plurality of signal lines by supplying current from the current supply line, and a fourth step of cutting the outer periphery of the substrate by LN21, working an outline of the substrate and removing the cavity forming part to work a cavity. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
