| 摘要 |
PROBLEM TO BE SOLVED: To provide a test pattern which allows for an easy check of whether an amount of positional deviation of via holes in a multilayer printed wiring board is within an accepted range or not, and to provide a method capable of 100% inspection of products. SOLUTION: A test coupon consists of inspection pads formed on outer layers in a product region of a printed board, a conductor solid pattern and via through holes formed in each inner layer, and clearances for insulating the conductor solid pattern and the via through holes from each other. By disposing the test coupons within the product region of the printed board, it can be easily checked whether the amount of positional deviation of the via holes is within the accepted range or not by existence/non-existence of electrical continuity. COPYRIGHT: (C)2008,JPO&INPIT |
