发明名称 Semiconductor Device and Method of Manufacturing the Same
摘要 A punch-through type IGBT generally has a thick p<SUP>++</SUP>-type collector layer. Therefore, the FWD need be externally attached to the IGBT when the IGBT is used as a switching element in an inverter circuit for driving a motor load, and thus the number of processes and components increases. In the invention, trenches are formed penetrating through a collector layer and reaching a buffer layer. A collector electrode is formed in the trenches, too. With this structure, a current path is formed between an emitter electrode and the collector electrode without through the collector layer and functions as the FWD.
申请公布号 US2008135870(A1) 申请公布日期 2008.06.12
申请号 US20070933897 申请日期 2007.11.01
申请人 SANYO ELECTRIC CO., LTD.;SANYO SEMICONDUCTOR CO., LTD. 发明人 OKADA KIKUO;KAMEYAMA KOJIRO
分类号 H01L29/739;H01L21/331 主分类号 H01L29/739
代理机构 代理人
主权项
地址