发明名称 BANDPASS FILTER
摘要 PROBLEM TO BE SOLVED: To provide a further miniaturized bandpass filter without spoiling its filter characteristics. SOLUTION: The bandpass filter comprises a first dielectric layer 1, a second dielectric layer, a first signal line 2, and a second signal line 3. The first signal line 2 and the second signal line 3 are bonded on one surface and the other surface of the first dielectric layer 1, respectively. The end sections of the lines put the first dielectric layer 1 between them to form an overlapped continuous line of a predetermined length L when it is seen from the viewpoint of a horizontal plane. While one surface of the second dielectric layer is bonded on the other surface of the first dielectric layer 1 so that the second signal line 3 may be inserted, a ground layer is bonded on the other surface of the second dielectric layer, and a radio absorptive layer is bonded on one surface of the first dielectric layer 1 so that the first signal line 2 may be inserted. The continuous line is folded and curved to substantially a shape of S character when it is seen from the viewpoint of a horizontal plane, and the curvature radius r of the curved section is established as 0.8 mm or more. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008135907(A) 申请公布日期 2008.06.12
申请号 JP20060319639 申请日期 2006.11.28
申请人 DAIDO STEEL CO LTD 发明人 TSUTSUI KAZUHISA;SAITO AKIHIKO
分类号 H01P1/203 主分类号 H01P1/203
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