发明名称 SOLDERING REFLOW OPERATION MONITORING SYSTEM, OPERATION MONITORING DEVICE, AND SOLDERING REFLOW CONDITION SETUP METHOD
摘要 PROBLEM TO BE SOLVED: To obtain automatic setting of target reflow qualification, in real time, for each substrate without being restricted by the radio wave reachable distance. SOLUTION: In a soldering reflow operation monitoring system, a sensor network which performs multi-hop wireless communication is built by using two or more sensor nodes, including a first sensor module 14 protected with heat resisting material and used for detecting temperature of a soldering reflow furnace 11 and a second sensor module 15, provided at a conveyance start point and a conveyance end point of a conveyance path 12 and used for detecting the passage of a substrate 3. A controller 22 generates has a constitution wherein the temperature profile of the substrate, based on the temperature information and passage information which are acquired by sensor network, the generated temperature profile is evaluated, and the conveyance speed of the conveyance path 12 or the temperature setting of the soldering reflow furnace 11 is changed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008135658(A) 申请公布日期 2008.06.12
申请号 JP20060322180 申请日期 2006.11.29
申请人 HITACHI LTD 发明人 ISHII TATSUE;OISHI SATOSHI;YOSHIZAWA TAKASHI;NIIMURA YONEMITSU
分类号 H05K3/34 主分类号 H05K3/34
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