| 摘要 |
PROBLEM TO BE SOLVED: To provide equipment for removing a soldered electrical component from the component plane without removing a substrate mounting the electrical component, i.e., a completed product, from the housing on a factory line and without soiling or damaging the product or the substrate while reducing the time and effort. SOLUTION: A substrate 1 to which an electrical component 2 is attached is incorporated in a housing, a tubular grip 8 communicating with a solder temperature regulator 6 incorporating a heater, and the like, is arranged above the substrate, a valve element 9 for supplying solid state older is provided at the lower end of the grip, a molten solder transfer pipe 10 communicating with the grip is provided on the underside thereof at the right and left positions of the electrical component mounted on the substrate, the lower end of the molten solder transfer pipe is formed into a nozzle 11 located at the part of a terminal 3 soldered to the electrical component, and a pushing means 13 having a knob 12 which moves the nozzle portion to a position for clamping the terminal portion of the electrical component is fixed to a lower portion of the molten solder transfer pipe. COPYRIGHT: (C)2008,JPO&INPIT
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