发明名称 WIRING FORMATION METHOD AND MANUFACTURING METHOD OF LIQUID DROPLET DISCHARGE HEAD EQUIPPED WITH THE WIRING
摘要 PROBLEM TO BE SOLVED: To provide a wiring formation method which enables a certain elimination of a metal film on the level-difference lower surface of a substrate having the level difference and the manufacturing method of a liquid droplet discharge head equipped with the wiring, with controlling the manufacturing process and cost. SOLUTION: The wiring formation method includes the process of forming metal films 92, 93 on the whole surface of reservoir formation substrate 30, the process of forming a resist film 94 on the surface of the metal films 92, 93 on a stepped top surface 71, the process of eliminating the metal films 92, 93 on the stepped lower surface 72 using the resist film 94 as the 1st mask and the process of etching the metal films 92, 93 on the stepped top surface 71 using the 2nd mask formed by patterning the resist film 94. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008132700(A) 申请公布日期 2008.06.12
申请号 JP20060321471 申请日期 2006.11.29
申请人 SEIKO EPSON CORP 发明人 YODA TAKESHI
分类号 B41J2/16 主分类号 B41J2/16
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