| 摘要 |
A microphone arrangement comprises a stack arrangement ( 1 ) which comprises a first semiconductor body ( 10 ) having a microphone structure ( 13 ) and a second semiconductor body ( 80 ). The second semiconductor body ( 80 ) comprises a first main face ( 81 ) on which an integrated circuit ( 83 ) is arranged and a second main face ( 82 ) which faces the first semiconductor body ( 10 ).
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