发明名称 SOLDER FLUX
摘要 A soldering flux composition comprising: a carrier vehicle comprising a solvent; an activator component for activating a metal surface for soldering; a component selected from one or more compounds within the structural formula I, wherein each R is independently selected from C<SUB>1</SUB>-C<SUB>15</SUB> alkyl, C<SUB>6</SUB>-C<SUB>15</SUB> aryl, C<SUB>2</SUB>-C<SUB>15</SUB> alkenyl; C<SUB>2</SUB>-C<SUB>15</SUB> alkynyl; C<SUB>1</SUB>-C<SUB>15</SUB> alkoxy, or derivatives thereof for example halogenated derivatives thereof. Quadrol is one suitable compound. The composition of the invention provides good through hole fill such as in wave flow soldering processes.
申请公布号 WO2008009475(A3) 申请公布日期 2008.06.12
申请号 WO2007EP06489 申请日期 2007.07.20
申请人 HENKEL LOCTITE ADHESIVES LTD.;LAWRENCE, FRANK, TIMOTHY 发明人 LAWRENCE, FRANK, TIMOTHY
分类号 B23K35/362;H05K3/34 主分类号 B23K35/362
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