| 摘要 |
A substrate bonding apparatus is provided to increase the bonding throughput of substrates by providing a measuring device and a perspective window so that a user can directly confirm whether substrates are properly mounted at their respective chambers. A substrate bonding apparatus comprises the first chamber(100), the second chamber(200) and a measuring device. The first chamber has a cave-in surface at which the first substrate(S1) is mounted. The second chamber, combined with the first chamber, forms a bonding space. The second chamber has a protruded surface at which the second substrate(S2) is mounted. The measuring device is installed at the side of the first chamber so as to confirm whether or not the first and second substrates respectively are mounted at the first and second chambers correctly. Also a perspective window(430) to observe the space between the first substrate and the second substrate is installed at the side of the first chamber. |
