| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate incorporating electronic component that can reduce the complication in a manufacturing step and improve the degree of freedom in the position of electrical connection between wiring patterns of facing wiring boards, and to provide its manufacturing method. <P>SOLUTION: In the substrate incorporating electronic component, wiring boards 1 and 2 with wiring patterns 10 and 20 formed on one surface in the direction of thickness are opposed each other in the direction of thickness so that the joint parts 10a and 20a of the respective wiring patterns 10 and 20 may be overlapped each other, and an active element 50 and a passive element 51 to be incorporated between the wiring boards 1 and 2 are mounted on a second wiring board 2 and a to a first wiring board 1, respectively. An insulation part 6 made of insulative resin is interposed between the wiring boards 1 and 2 to cover both active element 50 and passive element 51, and a metal ball 7 is also interposed between the wiring boards 1 and 2 so as to keep a distance between the wiring boards 1 and 2 at a regulated distance that is set larger than a mounting dimension for both active element 50 and passive element 51, as well as to electrically connect the joint parts 10a and 20a with each other. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
