| 摘要 |
A substrate bonding apparatus is provided to shorten process time by enabling the second chamber to be horizontally shifted for the first chamber in a vacuum state that the air-tightness and gap between the first chamber and the second chamber are regularly maintained. A substrate bonding apparatus comprises the first chamber(110), the second chamber(120), a main sealing member and an alignment adjusting part(140). The first chamber supports the first substrate(S1). The second chamber, separated from the first chamber, supports the second substrate(S2) to be bonded with the first substrate. The main sealing member, located between the first chamber and the second chamber, is provided to maintain the air-tightness and gap between the first chamber and the second chamber. The alignment adjusting part, located between the first chamber and the second chamber, maintains the air-tightness and gap between the first chamber and the second chamber. While maintaining the air-tightness and gap between the first chamber and the second chamber, the alignment adjusting part enables the second chamber to make a sliding motion for the first chamber. |
