| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition for semiconductors having low melt viscosity and good adhesion strength and making it possible to improve the connection reliability of a semiconductor apparatus, an adhesive sheet for semiconductors, and a semiconductor apparatus obtained using them. <P>SOLUTION: This adhesive composition for semiconductors is an adhesive composition containing a thermoset resin and a filler, wherein the blending ratio of the filler to the thermoset resin ranges from 30 to 100 parts by mass to 100 parts by mass of the thermoset resin and the thermoset resin comprises (A) a high-molecular-weight component having a crosslinkable functional group, a weight average molecular weight ranging from 100,000 to 600,000, and a glass transition temperature ranging from -50 to 50°C, (B) a polyfunctional epoxy resin with a molecular weight of 500 or more, and (C) a phenol resin at a mass ratio of (A):(B):(C)=15 to 40:5 to 15:35 to 55. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
