发明名称 POLYAMIDE FILM AND GAS-BARRIER FILM
摘要 PROBLEM TO BE SOLVED: To improve the adhesion of an inorganic oxide layer to a substrate film made of a polyamide resin. SOLUTION: A transparent polyamide film 110 includes: a substrate film 111 made of the polyamide resin; and an easy adhesion layer 112 obtained by applying plasma treatment to a resin layer formed on the substrate film by using a mixture containing a water-dispersible polyester polyurethane and/or a water-dispersible polyester polyurethane polyurea resin and bisphenol glycidyl ether. The ratio D<SP>*</SP>/D<SP>0</SP>between the mole ratio D<SP>*</SP>of a urethane linkage to the C-C linkage of the surface of the easy adhesion layer 112 after the application of the plasma treatment and the mole ratio D<SP>0</SP>of the urethane linkage to the C-C linkage of the surface of the resin layer before the application of the plasma treatment is larger than 0.75 and smaller than 0.97. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008132625(A) 申请公布日期 2008.06.12
申请号 JP20060318941 申请日期 2006.11.27
申请人 TOPPAN PRINTING CO LTD 发明人 FUKUGAMI YOSHISUE
分类号 B32B27/34;B32B9/00 主分类号 B32B27/34
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