| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To carry out solder bonding, while arranging a solder between a semiconductor element and a heat sink block with superior positional accuracy, in a manufacturing method of a semiconductor device wherein the heat sink block is bonded, through soldering in the soldering region of the semiconductor element whose one surface is divided into a soldering region where soldering is conducted, and a non-soldering region where the soldering is not conducted. <P>SOLUTION: Wettable solder, in which solder 40 is previously molten and adhered, is applied on one surface 51 of the heat sink block 50 and, next, one surface 11 of the semiconductor element 10 and one surface 51 of the heat sink block 50 are positioned through the solder 40; after that, the solder 40 is made to reflow to bond the semiconductor element 10 and the heat sink block 50. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
