发明名称 WIRING SUBSTRATE AND SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE USING THE SAME
摘要 A wiring substrate (2) includes an insulating layer (7) and a via conductor (8) embedded in the insulating layer (7). The via conductor (8) has a narrowed portion (80) inclined against the horizontal direction X.
申请公布号 WO2008069055(A1) 申请公布日期 2008.06.12
申请号 WO2007JP72874 申请日期 2007.11.27
申请人 KYOCERA CORPORATION;NAGASAWA, TADASHI;HAGIHARA, KIYOMI;HAYASHI, KATSURA 发明人 NAGASAWA, TADASHI;HAGIHARA, KIYOMI;HAYASHI, KATSURA
分类号 H05K1/11;H01L23/12;H05K1/03;H05K1/18 主分类号 H05K1/11
代理机构 代理人
主权项
地址