A SURFACE-MOUNTABLE WAVEGUIDE ARRANGEMENT

摘要

The present invention relates to a surface-mountable waveguide arrangement (35) comprising a dielectric carrier material (1, 39) having a first main side (2, 40) and a second main side (3, 41), the second side (3, 41) comprising a ground plane (31), and the first side (2, 40) being arranged to form a microwave circuit layout by means of metalization patterns on the respective sides (2, 3; 40, 41). The microwave circuit layout comprises a footprint (4, 42) for a surface-mountable waveguide part (5, 43), the waveguide part (5, 43) comprising an open side (17, 59), a part of the footprint (4, 42) constituting a closing wall (18, 60) arranged for closing the open side (17, 59). The waveguide part (5, 43) is arranged for being mounted to a footprint solder area (19, 61) comprised in the footprint (4, 42), having an outer contour (20, 62) and corresponding to a solderable contact area (21, 63) on the waveguide part (5, 43). A solderstop line (29, 72) is formed on the footprint (4, 42), at least partly defining a border between the closing wall (18, 60) and the footprint solder area (19, 61). The present invention also relates to a dielectric carrier.