| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which has a high dimensional accuracy and has a high airtightness by suppressing the occurrence of a gap between the wall surface of a through hole formed in an insulation layer and a via hole conductor. SOLUTION: The multilayer wiring board consists of alternately stacked first insulation layers and second insulation layers. The second insulation layers have a burning shrinkage start temperature higher than the burning shrinkage finish temperature of the first insulation layers. The via hole conductors are so formed as to be penetrated through a laminate consisting of one set of first insulation layer and second insulation layer. On the surface of the laminate on the first insulation layer side, lands are so formed as to be connected to the via hole conductors and cover the via hole conductors. Each land 5 consists of an inside restrained portion 51 and an outside conductor portion 52 so formed as to wrap around the inside restrained portion 51. The burning shrinkage start temperature of either the inside restrained portion 51 or the outside conductor portion 52 is higher than the burning shrinkage finish temperature of the other. COPYRIGHT: (C)2008,JPO&INPIT |
