发明名称 |
PATTERN FORMING METHOD AND PATTERN FORMING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pattern forming method by which a pattern to be formed on a substrate while heating the substrate is highly accurately formed on a desired position. <P>SOLUTION: A stage 23 is movable along the Y-arrow direction and the opposed Y-arrow direction every 0.5 μm. An ejection timing signal is corrected based on the expansion degree of a mother sheet 4M due to heating. Because the landing position of a droplet from a nozzle is corrected every 0.5 μm based on the expansion degree of the mother sheet 4M, the droplet is landed on a required position in a divided area even when the mother sheet 4M is expanded. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008132452(A) |
申请公布日期 |
2008.06.12 |
申请号 |
JP20060321267 |
申请日期 |
2006.11.29 |
申请人 |
SEIKO EPSON CORP |
发明人 |
MIURA HIROTSUNA;TOYODA NAOYUKI |
分类号 |
B05D1/26;B05C5/00;B05C9/14;B41M5/00 |
主分类号 |
B05D1/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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