发明名称 PATTERN FORMING METHOD AND PATTERN FORMING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a pattern forming method by which a pattern to be formed on a substrate while heating the substrate is highly accurately formed on a desired position. <P>SOLUTION: A stage 23 is movable along the Y-arrow direction and the opposed Y-arrow direction every 0.5 &mu;m. An ejection timing signal is corrected based on the expansion degree of a mother sheet 4M due to heating. Because the landing position of a droplet from a nozzle is corrected every 0.5 &mu;m based on the expansion degree of the mother sheet 4M, the droplet is landed on a required position in a divided area even when the mother sheet 4M is expanded. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008132452(A) 申请公布日期 2008.06.12
申请号 JP20060321267 申请日期 2006.11.29
申请人 SEIKO EPSON CORP 发明人 MIURA HIROTSUNA;TOYODA NAOYUKI
分类号 B05D1/26;B05C5/00;B05C9/14;B41M5/00 主分类号 B05D1/26
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