发明名称 POSITIVE RESIST MATERIAL AND PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist material having high resolution in an ArF lithography technique and capable of giving a pattern with small line edge roughness and high rectangularity, and a pattern forming method therefor. <P>SOLUTION: The positive resist material contains a resin component (A) which is made soluble in an alkali developer by the action of an acid and a compound (B) which generates an acid in response to an actinic ray or radiation, wherein the resin component (A) is a high molecular compound having a repeating unit of formula (1) (wherein R<SP>1</SP>is H, CH<SB>3</SB>or CF<SB>3</SB>; R<SP>2</SP>is a monovalent hydrocarbon group which may contain a hetero atom; m and n are 1 or 2; p is 0, 1 or 2; q is 0 or 1; a, b, c and d are 0.01 to <1, and a+b+c+d=1), and the compound (B) which generates an acid is a sulfonium salt compound. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008134528(A) 申请公布日期 2008.06.12
申请号 JP20060321631 申请日期 2006.11.29
申请人 SHIN ETSU CHEM CO LTD 发明人 NISHI TSUNEHIRO;TACHIBANA SEIICHIRO;KOBAYASHI KATSUHIRO
分类号 G03F7/039;C08F220/28;G03F7/004;G03F7/11;H01L21/027 主分类号 G03F7/039
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