发明名称 |
STACK PACKAGE AND STACK PACKAGING METHOD |
摘要 |
Provided are a stack package and a stack packaging method. The stack package includes: a first package; and a second package stacked on the first package, wherein external leads of the first package and the second package are directly connected to one another and inner leads thereof are arranged in different shapes so that the Chip Select signal of the second package are input through a No Select pin of the first package.
|
申请公布号 |
US2008136008(A1) |
申请公布日期 |
2008.06.12 |
申请号 |
US20070951048 |
申请日期 |
2007.12.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YOON SUNG-HWAN;SONG BEUNG-SEUCK |
分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|