PLANARIZATION COMPOSITION FOR METAL SURFACES COMPRISING AN ALUMINA HYDRATE ABRASIVE

摘要

The present invention provides CMP abrasive slurry that is substantially free of aluminum oxide and comprises liquid and solids wherein the solids comprises: (a) in an amount of at least about 90 weight percent based on the solids, at least one non-spherical component having formula Al<SUB>2</SUB>O<SUB>3</SUB>-xH<SUB>2</SUB>O where x ranges from 1 to 3; and (b) up to about one weight percent based on the solids portion of submicron alpha-alumina. The CMP abrasive slurry may be used to polish metallic or dielectric surfaces in computer wafers.