发明名称 EPITAXIAL WAFER AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an epitaxial wafer manufacturing method for manufacturing a light emitting element (e.g., a red LED) with high luminance by reducing carbon mixture being one main cause of luminance deterioration. <P>SOLUTION: The epitaxial wafer manufacturing method is the method for successively growing an epitaxial layer, including an active layer and a clad layer, on a substrate by an liquid phase epitaxial growth method. Time for holding at the highest achieving temperature is made to be 1.25-2 hr in order to allow the amount of carbon to be taken into the epitaxial layer to be within the range of 3 to 6&times;10<SP>17</SP>atoms/cc when the epitaxial layer is made to grow. After that, the temperature is made to fall, and the epitaxial layer grows during the falling of the temperature. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008135647(A) 申请公布日期 2008.06.12
申请号 JP20060322029 申请日期 2006.11.29
申请人 HITACHI CABLE LTD 发明人 SUGAWARA TEPPEI
分类号 H01L21/208;C30B25/16;H01L33/30 主分类号 H01L21/208
代理机构 代理人
主权项
地址