发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING BASE MATERIAL AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE USING IT |
摘要 |
PROBLEM TO BE SOLVED: To prevent the warp of a substrate by a stress relaxing pattern, and to suppress the outflow of a cooling gas through the stress relaxing pattern as required without the problem of the lowering of the strength of a stress relaxing pattern substrate. SOLUTION: The object is attained by at least one of a discontinuity from the innermost side in the peripheral region 4b of a mask layer 2 to the place of the outer periphery of the substrate 1 of a stress relaxing pattern 3 and a regulation defining that an etching depth H2 in an etching working to the substrate 1 is less than a normal etching depth H1 by a working pattern 4 while the internal stress of the mask layer 2 is relaxed sufficiently by the stress relaxing pattern 3 formed to the peripheral region 4b of the mask layer 2 to prevent the warp of the substrate 1. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008135546(A) |
申请公布日期 |
2008.06.12 |
申请号 |
JP20060320255 |
申请日期 |
2006.11.28 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
OKITA SHOGO;HOUCHIN RIYUUZOU |
分类号 |
H01L21/3065 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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