| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has good dielectric characteristics and their excellent absorbed moisture dependence in high frequency bands, can significantly reduce transmission loss, is excellent in moisture absorption heat resistance and thermal expansion characteristics, and can produce printed circuit boards satisfying peeling strength between a substrate and a metal foil. SOLUTION: The thermosetting resin composition containing an un-cured semi-IPN type composite material is characterized in that the un-cured semi-IPN type composite material is an un-cured semi-IPN type composite material with which (A) polyphenylene ether and a prepolymer formed from (B) a chemically non-modified butadiene polymer containing 1,2-butadiene units having 1,2-vinyl groups in side chains in an amount of ≥40% in the molecule and (C) a cross-linking agent are compatibilized, and the composition further contains an inorganic filler whose surface is treated with (D) a vinyl group-containing silane coupling agent. Further, a resin varnish, a prepreg, and a metal-clad laminate using the same are also provided. COPYRIGHT: (C)2008,JPO&INPIT
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