SUBSTRATE HEATING APPARATUS AND SEMICONDUCTOR FABRICATION METHOD

摘要

A substrate heating apparatus and a semiconductor manufacturing method are provided to improve exhaust conductance around a substrate by forming a through-hole for connecting a space between a cap and the substrate with a space in a process chamber. A heating member(4) heats a substrate(3) positioned in a process chamber(1). A susceptor(2) is interposed between the heating member and the substrate. A heat receiving member is installed opposite to the susceptor to receive the heat generated by the heating member through the susceptor. A space between the heat receiving member and the substrate is communicated with a space(13b) in the process chamber via a ventilation portion.