发明名称 CIRCUIT CONNECTION STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a circuit connection structure capable of achieving an excellent electrical connection between opposed circuit electrodes and sufficiently enhancing the long-term reliability of the electrical characteristic between the circuit electrodes. <P>SOLUTION: A circuit connection structure includes: a first circuit member 30 in which a first circuit electrode 32 is formed on a main surface 31a of a first circuit board 31; a second circuit member 40, arranged while facing the first circuit member 30, in which a second circuit electrode 42 is formed on a main surface 41a of a second circuit board 41; and a circuit connection member 10 which is provided between the main surface of the first circuit member 30 and the main surface of the circuit member 40 to electrically connect the first and second circuit electrodes 32 and 42. The first and second circuit electrodes 32 and 42 have a thicknesses of 50 nm or more. The circuit connection member 10 is acquired by curing a circuit connection material which contains an adhesive composite and conductive particles 12 wherein a plurality of projections 14 are arranged on the surface side thereof. The outermost layer of the conductive particles 12 is formed by a nickel or a nickel alloy, thereby the circuit connection structure 1 is constituted. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008135734(A) 申请公布日期 2008.06.12
申请号 JP20070280782 申请日期 2007.10.29
申请人 HITACHI CHEM CO LTD 发明人 KOJIMA KAZUYOSHI;KOBAYASHI KOJI;ARIFUKU MASAHIRO;MOCHIZUKI AKIOMI
分类号 H01L21/60;C09J9/02;H01B1/00;H01B1/22;H01R11/01 主分类号 H01L21/60
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