| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a semiconductor device that prevents exfoliation and the occurrence of cracks. <P>SOLUTION: The semiconductor device has a first semiconductor chip mounted on a die pad via a first adhesive, a second semiconductor chip mounted on the die pad via a second adhesive while being arranged so as to make its one side face and one side face of the first semiconductor chip face each other across a through hole, a wire connecting between the first/second semiconductor chips, and a transfer mold resin. A distance between the first and the second semiconductor chips is less than or equal to 1 mm. The first and second adhesives respectively exist immediately under each edge of the side faces, facing each other, of the first and second semiconductor chips. <P>COPYRIGHT: (C)2008,JPO&INPIT |
