发明名称 |
Resin Substrate Material, Electronic Component Substrate Material Manufactured by Electroless Plating on the Same, and Method for Manufacturing Electronic Component Substrate Material |
摘要 |
There is provided a technology that can be applied as a substrate material to ordinary resin substrate materials and allows the adhesive strength between this substrate material and a plating metal layer to be increased; more specifically, there is provided an ordinary resin substrate material with an increased adhesive strength between the substrate material and a plating metal layer. The present invention relates to a resin substrate material such as an epoxy resin whose surface is swellable in a solution containing imidazolesilane and a palladium or other noble metal compound having a catalytic action in electroless plating and which has been surface-treated with the solution, and to an electronic component substrate material manufactured by performing electroless plating on this resin substrate material.
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申请公布号 |
US2008138629(A1) |
申请公布日期 |
2008.06.12 |
申请号 |
US20060795355 |
申请日期 |
2006.02.27 |
申请人 |
KAWAMURA TOSHIFUMI;IMORI TORU |
发明人 |
KAWAMURA TOSHIFUMI;IMORI TORU |
分类号 |
B32B15/08;C23C18/31 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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