发明名称 |
COOLING APPARATUS FOR ELECTRONICS |
摘要 |
In one embodiment, an apparatus includes a monolithically formed thermal conducting body that includes a passageway that extends from a first end to a second end of the body. At least one of the first end or the second end of the body is configured to couple the body to a tubular member. The body also defines a substantially non-circular outer perimeter, and at least a portion of the passageway of the body defines a substantially circular cross-section. The passageway of the body is configured to receive fluid there through, and the body has a substantially planar outer surface that is configured to be placed in contact with a heat generating component. In some embodiments, the body can be coupled to a plate. In some embodiments, an apparatus can include more than one such thermal conducting body. |
申请公布号 |
WO2008030745(A3) |
申请公布日期 |
2008.06.12 |
申请号 |
WO2007US77122 |
申请日期 |
2007.08.29 |
申请人 |
ADVANCED ENERGY INDUSTRIES, INC.;STROBEL, KURT;MOROZOV, IGOR |
发明人 |
STROBEL, KURT;MOROZOV, IGOR |
分类号 |
F28F7/00 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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