发明名称 COOLING APPARATUS FOR ELECTRONICS
摘要 In one embodiment, an apparatus includes a monolithically formed thermal conducting body that includes a passageway that extends from a first end to a second end of the body. At least one of the first end or the second end of the body is configured to couple the body to a tubular member. The body also defines a substantially non-circular outer perimeter, and at least a portion of the passageway of the body defines a substantially circular cross-section. The passageway of the body is configured to receive fluid there through, and the body has a substantially planar outer surface that is configured to be placed in contact with a heat generating component. In some embodiments, the body can be coupled to a plate. In some embodiments, an apparatus can include more than one such thermal conducting body.
申请公布号 WO2008030745(A3) 申请公布日期 2008.06.12
申请号 WO2007US77122 申请日期 2007.08.29
申请人 ADVANCED ENERGY INDUSTRIES, INC.;STROBEL, KURT;MOROZOV, IGOR 发明人 STROBEL, KURT;MOROZOV, IGOR
分类号 F28F7/00 主分类号 F28F7/00
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