Backing film adapted for preventing electronic module electrostatic discharges and method of manufacturing a module implementing the backing film

摘要

The film (1) has a linear film comprising metal outer rails (13, 15) on sides, and single earthing contact pad (17) connected to one of the rails by one of metal tracks (19, 27). The metal track (19) is extended from one of the sides of the film till the rail (13), and the metal track (27) is extended on an opposite surface and connected to the rail (15). Two locations receive two superimposed electronic chips. An independent claim is also included for a method for fabricating an electronic module.