发明名称 RINSING LIQUID FOR LITHOGRAPHY AND METHOD FOR RESIST PATTERN FORMATION
摘要 This invention provides a novel rinsing liquid for lithography, which, for a photoresist pattern, can reduce surface defects, the so-called defects, without sacrificing the quality of the product, and, at the same time, can impart resistance to electron beam irradiation to suppress the shrinkage of the resist pattern, and a method for resist pattern formation using the same. A resist pattern is formed by preparing a rinsing liquid for lithography comprising an aqueous solution containing (A) a water-soluble and/or alkali-soluble polymer having a nitrogen atom in its molecular structure and (B) at least one member selected from aliphatic alcohols and alkyletherification products thereof, and then carrying out (1) the step of providing a photoresist film on a substrate, (2) the step of selectively exposing the photoresist film thorough a mask pattern, (3) the step of heat-treating the exposed photoresist film, (4) the step of carrying out alkali development, and (5) the step of treating the developed film with the rinsing liquid for lithography.
申请公布号 EP1930775(A1) 申请公布日期 2008.06.11
申请号 EP20050781041 申请日期 2005.08.29
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 SAWADA, YOSHIHIRO;WAKIYA, KAZUMASA;KOSHIYAMA, JUN,;MIYAMOTO, ATSUSHI;TAJIMA, HIDEKAZU,
分类号 G03F7/32;H01L21/027 主分类号 G03F7/32
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