发明名称 |
RADIO FREQUENCY OVER-MOLDED LEADFRAME PACKAGE |
摘要 |
An over-molded leadframe (e.g., a Quad Flat No-lead (QFN)) package capable of operating at frequencies in the range of about five gigahertz (GHz) to about 300 GHz and a method of making the QFN package are disclosed. The QFN package includes a capacitance lead configured to substantially reduce and/or offset the inductance created by one or more wirebonds used to connect an integrated circuit (IC) chip on the package to an input/output (I/O) lead. The IC chip is connected to the capacitance lead via one or more wirebonds, and the capacitance lead is then connected to the I/O lead via at least a second wirebond. Thus, inductance created by the one or more wirebonds on the package is substantially reduced and/or offset by the capacitance lead prior to a signal being output by the package and/or received by the IC chip. |
申请公布号 |
EP1929523(A1) |
申请公布日期 |
2008.06.11 |
申请号 |
EP20060751843 |
申请日期 |
2006.05.01 |
申请人 |
U.S. MONOLITHICS, L.L.C. |
发明人 |
TORKINGTON, RICHARD, S.;LYONS, MICHAEL, R.;BUER, KENNETH, V. |
分类号 |
H01L23/66;H01L23/49;H01L23/498 |
主分类号 |
H01L23/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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