TRANSPARENT CONDUCTING LINE STRUCTURES FOR TRANSPARENT ELECTRONIC DEVICES

摘要

Wiring structures for transparent electronic devices are provided to minimize the loss of transparency and to lower the resistance value of a transparent wire by using a metal spacer and a wire with a double conductive layer. A lower conductive layer(32) having transparency is formed on a substrate(31). A dielectric layer(33) having transparency is formed on the lower conductive layer. A wire layer(35) having transparency is formed on the dielectric layer. A connecting unit(34) electrically connects the lower conductive layer to the wire layer. The lower conductive layer is formed on the whole region or one region of the substrate. The connecting unit is connected to the whole region or one region of the wire layer. The lower conductive layer and the wire layer are respectively made of one of ITO, IZO, and ITZO. The connecting unit is made of the same material as one of the lower conductive layer and the wire layer.