发明名称 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF PATTERN FORMING AND ELECTRONIC PART
摘要 <p>A thermostable negative photosensitive resin composition excelling in sensitivity and resolution; a method of pattern forming in which use is made of the resin composition, permitting development with an alkali aqueous solution, and in which there can be obtained a pattern of good morphology excelling in sensitivity, resolution and heat resistance; and highly reliable electronic parts. Semiconductor substrate (1) provided with first conductor layer (3), second conductor layer (7) and interlayer insulating film (4) is spin coated with a negative photosensitive resin composition, dried and exposed to light emitted above a mask with a pattern for forming of window (6C) in given region. The resin composition is developed with the use of an alkali aqueous solution, heated (hardened), and provided with surface protective film (8). The above negative photosensitive resin composition contains (a) polymer soluble in an alkali aqueous solution, having a phenolic hydroxyl at a molecular terminal thereof, (b) compound generating an acid upon actinic light irradiation and (c) compound capable of crosslinking or polymerization by the action of an acid.</p>
申请公布号 KR20080052668(A) 申请公布日期 2008.06.11
申请号 KR20087009228 申请日期 2006.06.20
申请人 HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. 发明人 MINEGISHI TOMONORI
分类号 G03F7/038;G03F7/004;G03F7/037;H01L21/027 主分类号 G03F7/038
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