| 摘要 |
A wet etching apparatus is provided to prevent a spot of droplet type from being formed on a substrate by preventing a dried chemical from being locally chemically reacted with a rinsing solution. A chamber(131) has an etching unit for spraying a chemical(115a) and a rinsing unit for spraying a rinsing solution(125a). A substrate transfer unit(135) transfers a substrate(133) across the chamber towards the etching unit and the rinsing unit. A bar-shaped triple spraying unit is positioned at an interface of the etching unit and the rinsing unit to define a boundary of the etching unit and the rinsing unit, and has at least three slit nozzles. The slit nozzle has a length equal to or more than a width of the substrate.
|
