| 摘要 |
A semiconductor package is provided to prevent production of a yellow strip by forming a phosphor layer of uniform thickness on the basis of all light emitting surfaces of a light emitting device. A substrate(40) has a cavity with a bottom surface which is used as a light emitting device mounting region. A stepped portion(54) is formed on the inner surface of the cavity, and contacts the light emitting device mounting region. A light emitting device(42) is mounted on the light emitting device mounting region, and is spaced apart from the stepped portion. A phosphor layer(46) is filled in a space between the stepped portion and the light emitting device to enclose the light emitting device. An interval between lateral light emitting surfaces of the light emitting device and a side of the stepped portion is equal to a distance between upper light emitting surfaces of the light emitting device and an upper surface of the phosphor layer. |
