THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVES HAVING IMPROVED PROCESSING PROPERTY

摘要

A thermally conductive adhesive composition is provided to realize improved processability and moldability by reducing the viscosity of a slurry mixture for preparing an adhesive, thereby ensuring production of an adhesive layer having a desired uniform thickness particularly in a liquid crystal display device. A thermally conductive adhesive composition comprises: an acrylic adhesive resin; and an inorganic thermally conductive material having a BET specific surface area of 4.0 m^2/g or less. The acrylic adhesive resin is partially polymerized and has a viscosity of 6,000 cP or less. The acrylic adhesive resin comprises a C1-C12 alkyl (meth)acrylate monomer. The inorganic thermally conductive material is at least one selected from the group consisting of metal oxides, metal nitrides, metal carbides and metal hydroxides.